SPI：焊膏检查
“焊膏检查”在电子制造和学术科研领域是一个至关重要的质量控制环节。为了在书面和口头交流中更加便捷高效，该术语通常使用其英文缩写“SPI”。这一流程主要用于检测印刷在电路板上的焊膏质量，确保其厚度、面积和位置符合精密焊接的工艺要求。
Solder Paste Inspection具体释义
Solder Paste Inspection的英文发音
例句
- These examples illustrate that to perform an effective solder paste inspection, the inspection system must be able to provide not only area but also accurate volume and height information.
- 这些例子说明，要进行有效的焊膏检测，检测系统必须不仅能提供印刷焊膏的面积信息，还应能提供其精确的体积和高度信息。
- The system provide a reasonable and effective solution in optimizing solder paste inspection process and making full use of human resources.
- 系统在优化锡膏检测作业流程、充分利用人力资源上提供了一套合理的、有效的解决方案。
- Rapid, real-time, accurate and automatic solder paste inspection ( SPI ) has become an important technology which can improve the level of electronic manufacturing industry and product quality.
- 对锡膏印刷质量的快速、实时、准确的自动检测成为提高电子制造业水平和电子产品质量的重要技术。
- On the Surface Mount Technology production line, solder paste inspection as the first circle of testing Printed Circuit Board production, occupies the most important position.
- 表面贴装技术生产线上，锡膏检测作为印刷电路板贴装的第一道检测环节，占据最为重要的地位。
- It specifies the influence of the parameters of solder paste printing, printing cycle, ease operation of software and additional steps of cleaning and inspection on improving the quality of products.
- 阐述了锡膏印刷工艺参数，印刷周期，操作软件的易用性，以及清洗、检验等附加工序对实际生产量的影响。
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