WB:弱键
“Weak Bond”(常缩写为WB)是一种化学术语,指分子或原子间作用力较弱的相互作用,中文译为“弱键”。该缩写形式在学术与科研文献中广泛应用,尤其常见于化学及相关学科领域,便于快速书写和信息传递,提升专业交流的效率。
Weak Bond的英文发音
例句
- It is suggested that all the weak bond and bent bond as well as charged configuration are the principal forms of intrinsic defects in a-Si : H.
- 弱键(WB)、弯键和带电组态等是a-Si:H中本征缺陷的主要形式。
- Ultrasonic method is fitted for weak bond.
- 超声波测试法现在只适用于弱键(WB)合强度。
- Using ultrashort pulses of infrared laser can make a strong bond breaking of molecular weak bond remains unchanged, in order to achieve bond-selective dissociation of molecules.
- 使用超短红外脉冲激光可以使分子的强键断裂而弱键(WB)保持不变,从而实现分子的选键解离。
- On the foundation of the material remove principle of ceramic machining, by corresponding component design and heat treatment techniques, we can make weak bond plane in the ceramic and realize its machinability through controlling the microstructure and boundary stress.
- 根据陶瓷加工的材料去除原理,通过相应的组分设计和热处理工艺,可控制材料的显微结构及晶界应力,使陶瓷内部产生弱结合面,进而获得陶瓷材料的可加工性。
- The results show that two weak bond states situated in both sides of band gap have been contracted and shifted to the center of the gap as the weak bond is stretched.
- 结果表明,当弱键(WB)拉伸时,两个弱键(WB)态移动并收缩至带隙中央;
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