CP：芯片位置

“Chip Place”通常缩写为CP，以方便快速书写及使用。这一缩写常见于电子工程、半导体研究等学术与科技领域，其完整中文含义为“芯片位置”。

By carefully moving the board, the two footprints can be lined up and the chip is lowered into place.
小心移动面板，使这两个封装对齐，把芯片放到其对应的位置上。
Copper Dual Damascene processing for chip metallization, and C4 ( Flip-chip ) technologies of planar array chip packaging interconnection cause the electrochemical technologies place in the most complication processing for chip fabrication processing.
Cu芯片金属化的双大马士革处理和面阵列芯片封装互连的C4（倒装）技术使电化学技术置于最复杂的制造工艺技术之间。
The inclusion of TD would require an additional chip, and that could be difficult to place in a device as slim as the iPhone.
兼容TD标准将需要额外的芯片，而对于iPhone这种超薄手机，新增芯片设备将很困难。
The implantation of the chip was done in a series of surgeries that took place between December and March in Barcelona.
芯片移植由12月至次年3月的多次外科手术完成。
Based on the back end design of a test chip, the dissertation studies the key technology in a hierarchy place and route flow and some solutions on how to improve chip performance during the implantation.
本文以一个测试芯片的后端设计为例，来介绍一种层次化的布局布线流程的关键技术，以及后端实现过程中一些提高芯片性能的方案。

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