PECVD:等离子体增强化学气相沉积
等离子体增强化学气相沉积(Plasma Enhanced Chemical Vapor Deposition,简称PECVD)是一种广泛用于电子和材料科学领域的薄膜制备技术。采用等离子体辅助反应,该工艺可在较低温度下实现高品质薄膜的沉积,因此在半导体制造、光伏器件和功能涂层中应用普遍。使用缩写PECVD有助于在学术论文和技术文档中实现简洁高效的表达。
Plasma Enhanced Chemical Vapor Deposition具体释义
Plasma Enhanced Chemical Vapor Deposition的英文发音
例句
- The structure of microcrystalline silicon thin film solar cells prepared by very high frequency plasma enhanced chemical vapor deposition, is studied.
- 对甚高频等离子体增强化学气相沉积(PECVD)技术制备的微晶硅薄膜太阳电池进行了研究。
- A new plasma diagnostic system with Langmuir probe is designed to measure the plasma parameters in a plasma enhanced chemical vapor deposition ( PECVD ) vacuum coating machine.
- 开发了一个朗缪尔探针等离子体诊断系统对PECVD真空镀膜机进行了等离子体参数诊断。
- Different structural silicon thin films deposited by very high frequency plasma enhanced chemical vapor deposition ( VHF-PECVD ) were studied at the use of purifier or not.
- 本文采用VHFPECVD技术制备了不同结构的硅薄膜,分析研究了有、无纯化器对制备薄膜特性的影响。
- A series of microcrystalline silicon thin films were fabricated by very high frequency plasma enhanced chemical vapor deposition ( VHF-PECVD ) at different silane concentrations in a P chamber.
- 在掺杂P室采用甚高频等离子体增强化学气相沉积(PECVD)(VHF-PECVD)技术,制备了不同硅烷浓度条件下的本征微晶硅薄膜。
- Porous silica films were prepared on the glass substrate by plasma enhanced chemical vapor deposition ( PECVD ) system modulated by pulse negative bias voltage and silane as precursor gas.
- 采用由脉冲负偏压调节的等离子体增强化学气相沉积(PECVD)方法,以硅烷为源气体,在玻璃基片上沉积得到了多孔二氧化硅薄膜。
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