QFP：四方扁平包
“Quad Flat Pack”是电子工程与集成电路领域中的一个专业术语，常缩写为QFP，以方便书写和日常使用。它指的是一种集成电路封装形式，外形为方形扁平结构，中文译作“四方扁平封装”，广泛应用于各类电子元器件和科学文献中。
Quad Flat Pack的英文发音
例句
- Tensile strength of the quad flat pack ( QFP ) devices were determined by STR-1000 Joint Strength Tester and compared with the joints soldered with different pitches and different solder compositions QFP and SOP ( small outline package ).
- 采用微焊点强度测试仪（STR-1000型）测试了方形扁平式封装器件（QFP）的抗拉强度，并对不同间距、不同钎料成分的QFP和SOP结构焊点进行了比较。
- Soldering technology for quad flat pack devices ( QFP ) were studied by means of 90W diode-laser soldering system and the mechanical properties of micro-joints of QFP were compared with different laser power.
- 采用90W半导体激光软钎焊系统对方形扁平式封装器件（QFP）进行了焊接试验研究，并对不同激光输出功率下形成的QFP结构焊点进行了力学性能比较。
- The Research Study of Ceramic Quad Flat Pack(QFP)
- 陶瓷四边引线扁平外壳工艺研究
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