TSW：软轮

The Soft Wheel，通常缩写为TSW，以方便书写和使用。这一简称常见于综合性领域，尤其适用于尚未明确分类的相关场景。其中文含义为“软轮”。

Study on the soft - start wheel
软启动皮带轮的研究与试验
Prediction of the Effective Spectrum of Soft Terrain Under Driving Wheel
驱动轮下有效软路面谱的预测
The surface component of silicon wafer ground with soft abrasive grinding wheel was inspected and the chemical reaction between abrasives, additives and single crystal silicon was analyzed. The material removal model in silicon wafer grinding with soft abrasive grinding wheel was established.
通过检测软磨料砂轮磨削硅片表面的化学成分分析了磨料、单晶硅和添加剂之间在磨削过程中发生的化学反应，建立了软磨料砂轮磨削硅片的材料去除机理模型。
Aiming at the surface layer damage of silicon wafers in diamond grinding, a mechanical-chemical grinding ( MCG ) technology with soft abrasive grinding wheel was proposed.
针对金刚石砂轮磨削硅片的表面层损伤问题，提出采用软磨料砂轮的机械化学磨削技术。

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