SMT:表面安装技术
表面安装技术(Surface Mounting Technology,简称SMT)是为了便于书写和使用而广泛采用的缩写形式。这一技术术语在计算机及电子制造领域尤为常见,主要用于描述将电子元件直接安装在印制电路板表面的先进工艺方法,具有组装密度高、生产效率高等优点。
Surface mounting technology具体释义
Surface mounting technology的英文发音
例句
- In the surface mounting technology, the result of the solder printing is very big to the product quantity.
- 在电子装联技术中,焊膏印刷的效果对产品质量关系极大。
- Application of Surface Mounting Technology in Intelligent Circuit-Breakers
- 表面贴装技术在智能型断路器中的应用
- Surface Mounting Technology and Its Applications in Optoelectronic Devices
- 表面安装技术(SMT)及其在光电子器件中的应用
- Considered as a special IC, the pressure sensor integrates diffusion silicon sensing element, circuit for temperature compensation and signal conditioned circuit on a chip in the form of thick film hybrid IC, through using thick film technology and surface mounting technology.
- 将集成压力传感器作为一种特殊的集成电路,采用厚膜工艺与表面组装技术,以厚膜混合集成电路的形式,实现了扩散硅力敏元件与温度补偿电路及信号放大电路的集成。
- The existence conformations and functions of gold in such boards and blocks have been changed greatly with the development of flaky elements and Surface Mounting Technology ( SMT ).
- 片状元器件和表面安装技术(SMT)的发展,使电脑板卡中金的存在形态和功能发生了较大变化。
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