THT：通孔技术
“通孔技术”（Through Hole Technology，简称THT）是一种广泛应用于电子工程及相关学术领域的连接技术，其名称来源于元件引脚穿过电路板并焊接于对侧的装配方式。使用缩写THT不仅便于书写和交流，也有助于在技术文档与专业讨论中提高表达效率。
Through Hole Technology具体释义
Through Hole Technology的英文发音
例句
- The technology of the plating through hole of the printed circuit board was briefly introduced The plating through hole technology of the microwave printed circuit board were also illuminated.
- 本文在简单介绍印制板孔金属化加工技术的基础上，对微波印制板孔金属化加工技术进行了较为详细的论述。
- Pin - through - hole Reflow Soldering Technology
- 通孔再流焊技术
- Reliability of plated through hole ( PTH ) has close relationship with technology parameters during manufacture process.
- 镀通孔的可靠性与制造过程工艺参数有非常密切的关系。
- Rise and Decline of Deep Hole Machining Technology and New Breaking Through in 20th Century & Introduction of SIED Deep Hole Machining Integrated Technology
- 20世纪深孔加工技术的兴衰及新突破&介绍SIED深孔加工集成技术
- Through hole forming method, the hole sealing technique, hole cutting hole anti-reflection technology improvement, improve to the drilling effect.
- 并通过成孔方式、封孔技术、掏穴钻孔增透工艺的改进，提高了下向钻空效果。
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