SOC:片上基板

“Substrate On Chip”在学术和电子领域常被缩写为SOC,以便于简化书写并提升使用效率。这一术语的中文对应为“片上基板”,通常用于描述集成于单一芯片上的基底结构,常见于半导体技术和微电子器件的相关研究与开发中。

Substrate On Chip具体释义

  • 英文缩写:SOC
  • 英语全称:Substrate On Chip
  • 中文意思:片上基板
  • 中文拼音:piàn shàng jī bǎn
  • 相关领域soc 电子

Substrate On Chip的英文发音

例句

  1. Based on the analysis of substrate noise generated by digital circuits, the effects of substrate noise on analog circuits in a mixed-signal chip are described and analyzed.
  2. 讨论分析了混合信号集成电路衬底噪声耦合的机理,及对模拟电路性能的影响。
  3. FDA was used as the enzyme substrate. A high-throughput single-cell fluorescence was detected by epi-fluorescence microscopy on the chip.
  4. 以FDA作为细胞中酯酶的底物,我们利用这种简易微流控芯片对由酯酶引起反应产生荧光信号的细胞进行了高通量分析。
  5. The results show that : the changes of the solder balls ' morphology and the substrate cracks growth are more likely to happen on the non-uniform distribution of the chip.
  6. 实验结果表明:芯片上焊球分布不均匀处焊球形貌变化和基板裂纹萌生的几率大。
  7. A two dimensional and three dimensional chip-adhesive – substrate thermal stress model are built, and interfacial thermal stress distributions are computed based on different area ratios and thickness ratios of substrate to chip.
  8. 建立了二维和三维的芯片-粘结层-基板热力学模型,分析了不同的基板/芯片厚度比和面积比对层间热应力分布的影响。