SMA：表面安装组件
表面组装技术（Surface Mount Assembly，常缩写为SMA）是一种广泛应用于电子制造行业的装配工艺，尤其在计算机硬件和相关电子设备的生产中十分常见。其核心是将电子元器件直接贴装并焊接在印刷电路板的表面，从而实现高效、高密度的组装。使用缩写“SMA”便于在技术文档、生产流程和日常交流中快速书写与识别，有效提升沟通和工作效率。
Surface Mount Assembly具体释义
Surface Mount Assembly的英文发音
例句
- In surface mount assembly, the stencil is the gateway to accurate, repeatable solder paste deposition.
- 表面贴装，钢网是锡膏准确重复印刷的关键。
- A magazine providing the latest information on and analysis of technological developments and industry trends inf materials, components, equipment and methods for surface mount assembly.
- 提供用于表面贴装的材料、元件、设备和方法的最新技术发展和产业趋势。
- A survey to make high density multilayer thick film surface mount assembly and measures adopted for mount design and manufacturing technology for them are introduced.
- 介绍了研制大面积高密度多层厚膜表面组装件的概况及组装设计与制造工艺上所采取的措施。
- The flexibility of surface mount production in electronic circuit is analyzed, flexible manufacturing system of surface mount based on present surface mount assembly equipment is designed and key problems such as system component, information integration system and quality assurance system are discussed as well.
- 提出了利用现有组装设备形成电子电路表面组装柔性制造系统的设计思想。并对其中的系统组成、信息集成、质量保证体系的形成等关键问题进行了探讨。
- To Make High Density Multilayer Thick-film Surface Mount Assembly(SMA) with Large Area
- 表面贴装设备的性能检测大面积高密度多层厚膜表面组装件的研制
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